Monosotoropic

Anisotropic
Heat Seal Connectors

Summary

The heat Seal connector made its debut in response to the need of densifying electronic components in the age when light-thin-small items are required. It is a hot-pressed connector in which a circuit is formed on a thin polyester film with conductive paste and insulating Heat Seal paste (hot melt) by exercising the original paste manufacturing technology and the highly precise printing technology of the Japanese graphite industry.

Characteristics

• It is not necessary to maintain it under pressure when mounting it, and it can be made lighter, smaller, and thinner.
• It can be connected to un-solderable surfaces, including the surfaces of transparent electrode glass and ceramic boards.
• It can handle together any multi-contact electrodes.
• It is inexpensive when connecting because of simple operation.

Application

• Connection of LCD to PCB
• LCD to TAB, PCB to PCB
• COG to ZIF Connector
• Connection of Membrane switch

Anisotropic Conductive Paste

Summary

The company's anisotropic conductive paste is an anisotropic conductive bonding paste that has realized solderless mounting possible. In addition, it makes the equipment simpler than the conventional ACF thus to reduce mounting cost.

Characteristics

• It is a solvent-less one component type.
• It is a clean material that solves the environmental problems related to lead and flux.
• It can employ the coating method of dispense and screen printing.
• It cures fast in 3 to 7 seconds at 180 to 220°C.
• It is not only able to connect and adhere facing electrodes, but also insulates adjoining electrodes.
  

Application

• Connection of a COF?ETOP electrode to an LCD electrode.
• Mounting of chip parts.
• Mounting of bare chips.