Summary:

The heat Seal connector made its debut in response to the need of densifying electronic components in the age when light-thin-small items are required. It is a hot-pressed connector in which a circuit is formed on a thin polyester film with conductive paste and insulating Heat Seal paste (hot melt) by exercising the original paste manufacturing technology and the highly precise printing technology of the Japanese graphite industry.

Characteristics:

• It is not necessary to maintain it under pressure when mounting it, and it can be made lighter, smaller, and thinner.
• It can be connected to un-solderable surfaces, including the surfaces of transparent electrode glass and ceramic boards.
• It can handle together any multi-contact electrodes.
• It is inexpensive when connecting because of simple operation.

Application:

• Connection of LCD to PCB
• LCD to TAB, PCB to PCB
• COG to ZIF Connector
• Connection of Membrane switch

Flexible Printed Circuit Boards
(NGI Flex)

Summary:

NGI Flex is an FPC developed so that high-degree flexibility and highly densified mounting can be realized by fusing a heat Seal connector into FPC with the company's original printing technology. It can expand a range of designing.
Furthermore, "Anisotropic conductive adhesive", an original hot-melt material developed by the company, has responded to customers' requirements by simplifying connection, improving reliability, and reducing total cost.

Characteristics:

• Compliance with the high-densification and smaller-and-lighter requirements
• High reliability by low-temperature pressure-adhesion
• Total cost reduction
  

Composition:

1. FPC, single-sided type
This is an FPC with a conductive circuit on one side of the base film.
The company's original hot-melt material can be stored at normal temperature unlike ACF, and pressure-adhered at low temperature.

2. FPC/HSC, composite type
This is a new connector with FPC and HSC integrated with the company's own manufacturing method. Both types are available: one-sided and two-sided types.
It is characterized by highly densified mounting with the resistance stability of FPC and the high-degree flexibility (completely bendable) of HSC combined.
The connection to COG can be done at low temperature by rendering the adhering part heat seal. Wiring to the reverse side via a through hole renders the wiring board more densified by expanding the degree of freedom of circuit design.

Application:

• Various connectors for drawing COG modules
• Touch panels
• LCD modules
• PCB

Two-layer copper-clad polyimide film board (NGI Flex COF)

Summary:

NGI Flex COG is an FPC for COF in which adhesive-less 2-layer-FPC copper clad polyimide film, produced by the copper spattering/plating method and the PI resin casting method, is used as a base material.
In addition to the recent move in which LCD modules are rendered smaller, thinner, and lighter, COF material has been developed to meet the need for highly densified mounting of multi-chips.

Characteristics:

• Excellent in heat resistance with no adhesive layer used.
• Excellent in bending and flexural strength.
• Excellent in dimensional stability at high temperature.
• Super-fine pitch applicable.