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F-CCL (Flexible Copper Clad Laminate)

Made possible by our unique technology, NGI flexible printed circuit copper clad laminate has two options, clad laminate board which was bonded together by adhesive (three-layer CCL), and clad laminate board with non-adhesive (two-layer CCL).
They are available upon inquiry.
3 layers copper strain materials


Features


Structure

Method of manufacture for 3 layers F-CCL

Make of both-side copper strain materials is possible.

Materials of structure


Basic feature



Thickness of polyester film is applicable to 38/50/75/100 micron in addition to abovementioned.
Copper affixing materials can be supplied based of polyimide for heat-proof.

2 layers copper strain materials


Features

  • High heatproofness without adhesive layer
  • High endurance of folding, high flexibility
  • High stability of measure at high temperature
  • High solder heat proofness
  • Very hard to burn
  • Super fine pitch

Structure

Method of manufacture for 2 layers F-CCL

Make of both-side copper strain materials is possible.

Materials of structure


Basic feature


Copper affixing materials can be supplied based of polyester for reasonable cost.
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